更新日： 集計期間:Nov 26, 2025～Dec 23, 2025
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A transparent flexible substrate with wiring that cannot be seen with the naked eye.
It is a flexible substrate with invisible wiring that has a total light transmittance of 92.0% and allows for component mounting.
Support for component mounting is also available.
This is an FPC with electronic components mounted.
Rigid substrates and flexible printed circuit boards are integrated.
It is an FPC that combines a rigid substrate and a flexible printed circuit board.
The most standard specifications at a low cost.
This is the most basic structure of an FPC with a conductor pattern formed only on one side.
Noise countermeasure structure
This is an FPC with a shield structure that is effective for noise countermeasures.
It is a flexible circuit board that can be repeatedly stretched and contracted, and can follow deformation. FPC
While general flexible materials can be bent, they face challenges in folding and stretching. Due to their flexibility, stretchability, and ability to conform, they are expected to be used in a wide range of fields for flexible electronics devices, including wearables, sensors, displays, robotics, as well as pressure sensors and seat heaters. FPC.
Turnkey connector implemented! A thin polymer resin film is used as insulation.
"Flexible substrates / Rigid-flexible substrates" are alternatives to conventional wiring connections using wires or ribbon cables. Flexible printed circuits can reduce space and weight while improving reliability. They are made by etching copper-clad materials and using a thin polymer resin film as insulation between the conductor circuit patterns. In electronic device enclosures, turnkey subassemblies may be utilized, incorporating aerospace-grade connectors at the ends for space-saving and lightweight assembly. 【Features】 ■ Single-sided and double-sided flexible substrates ■ Multi-layer and rigid-flexible substrates ■ Electrical and optical flexible substrates ■ Specialized for IPC 6012/6013 Class 3, Types 1 to 4 *For more details, please refer to the PDF materials or feel free to contact us.
By applying a reinforcement plate, component mounting is also possible! It is often used as a substitute for FFC.
We would like to introduce the "Single-Sided/Dual-Sided Flexible Printed Circuit Boards" handled by Matsuwa Sangyo Co., Ltd. The single-sided (1 layer) type is a common specification for flexible printed circuit boards and is often used as a substitute for FFC. There are types with and without an adhesive layer between the base material and copper foil, and we can accommodate both at our company. The dual-sided (2 layers) type allows for more flexible wiring by incorporating through-holes (TH) into the flexible printed circuit board. Please feel free to consult us about multilayer flexible printed circuit boards with three layers or more. 【Shortest Delivery Record Examples】 ■ 1 layer ⇒ Shortest 2 days (AM data ⇒ shipped the next day) ■ 2 layers ⇒ Shortest 2 days (8 AM data ⇒ shipped the next day) *For more details, please refer to the related links or feel free to contact us.
We have a wealth of experience in custom and OEM projects.
■Features Flexible printed circuit boards (FPC boards) excel in flexibility and thinness, maintaining their electrical properties even when bent. The materials used for flexible printed circuit boards (FPC boards) include polyimide, known as coverlay, as an insulator, solder resist, and copper as the conductor. The basic structure of flexible printed circuit boards (FPC boards) consists of a film-like insulator with an adhesive layer formed on top, followed by a layer of conductor foil. The insulator covers and protects all areas except for the terminal and soldering sections. Produced in China, they are low-cost and ideal for value-added proposals. ■Specifications Base material thickness, copper foil thickness, copper foil type, coverlay color, resist color, and surface treatment will be manufactured according to customer specifications.
Double-sided type that allows for complex wiring.
This is an FPC with conductor patterns on both sides, allowing for complex wiring.
![[Example of Printed Circuit Board Manufacturing] Rigid-Flexible Board](https://image.mono.ipros.com/public/product/image/7c0/2001120580/IPROS81776454173382698581.png?w=280&h=280)
Effective even in cases where component mounting is limited! Here are examples of rigid-flexible circuit board manufacturing.
We would like to introduce an example of our "Rigid-Flexible Printed Circuit Board" manufacturing. This board integrates rigid and flexible substrates. It is effective for use in compact spaces, such as small modules, or in cases where component placement is limited. Please feel free to contact us when you need assistance. 【Overview】 ■ 6-layer IVH structure (FPC layers L4-5) ■ 4-layer 1-2-1 build-up structure (FPC layers L2-3) *For more details, please refer to the PDF document or feel free to contact us.
It is a flexible substrate effective for high-density wiring. FPC
Unlike conventional through holes, to avoid penetrating the hole, a via is placed directly under the pad. Fine hole processing using lasers is possible, making it effective for ultra-high-density wiring, etc. With the miniaturization and thinning of mobile devices, as well as the enhancement of communication devices, there is an increasing demand for high-density mounting of narrow pitch, multi-pin packages. Consequently, flexible substrates are also advancing in terms of high-layer count and high density. FPC
It is possible to create a simple mock-up of the base for those who want to analyze the internal structure of FPC products, troubleshoot issues, or pre-verify complex product shapes.
We would like to introduce the services provided by Stay Electronics Co., Ltd. The "Flexible Circuit Board Mock Production using a High-Performance Cutting Plotter" is a service that creates simple mock-ups of flexible circuit boards using polyimide film for those who have never handled flexible circuit boards before or wish to pre-validate complex product shapes. Additionally, the "Image Analysis using a Super Depth Multi-Angle Lens Microscope" can be utilized for internal structure analysis and defect analysis of FPC products. *For questions or inquiries, please call us or contact us at the email address below. 042-774-4555 stay-4555@staydenshi.jp Contact Person: Kumada, Kikuchi [Service Operations] ■ Image Analysis using a Super Depth Multi-Angle Lens Microscope ■ Flexible Circuit Board Mock Production using a High-Performance Cutting Plotter *For more details, please refer to the PDF document or feel free to contact us.
It is a flexible substrate that allows for a highly reliable connection.
By partially removing the base film, it is possible to form a conductor. By narrowing the pattern width, reliable connections to the opposing circuit or device can be achieved, similar to wire bonding. It is used in areas that require high density and high reliability, such as probes.
