Last Updated： Aggregation Period:Apr 29, 2026～May 26, 2026
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A transparent flexible substrate with wiring that cannot be seen with the naked eye.
It is a flexible substrate with invisible wiring that has a total light transmittance of 92.0% and allows for component mounting.
Support for component mounting is also available.
This is an FPC with electronic components mounted.
Rigid substrates and flexible printed circuit boards are integrated.
It is an FPC that combines a rigid substrate and a flexible printed circuit board.
For applications such as endoscopes, catheters, CT, and analytical devices! We introduce our flexible printed circuits (FPC) for medical devices.
We would like to introduce our "Long Flexible Printed Circuit Boards (FPC)" that we handle. We have a proven track record of achieving longer lengths by using crank and spiral shapes, and we can produce boards with lengths in the meter range and widths of less than 1mm. We are also capable of mounting 0402 size components. Additionally, we offer "Slit Flexible Printed Circuit Boards (FPC)" that can accommodate "twisting," as well as "Ultra-Fine Circuit Flexible Printed Circuit Boards (FPC)" that contribute to miniaturization and lightweighting of products through high-density design. 【Features of Long Flexible Printed Circuit Boards (FPC)】 ■ Capable of production in meter-class lengths ■ Capable of production with board widths of less than 1mm ■ Capable of mounting 0402 size components *For more details, please refer to the PDF document or feel free to contact us.
Noise countermeasure structure
This is an FPC with a shield structure that is effective for noise countermeasures.
The most standard specifications at a low cost.
This is the most basic structure of an FPC with a conductor pattern formed only on one side.
It is a flexible circuit board that can be repeatedly stretched and contracted, and can follow deformation. FPC
While general flexible materials can be bent, they face challenges in folding and stretching. Due to their flexibility, stretchability, and ability to conform, they are expected to be used in a wide range of fields for flexible electronics devices, including wearables, sensors, displays, robotics, as well as pressure sensors and seat heaters. FPC.
Turnkey connector implemented! A thin polymer resin film is used as insulation.
"Flexible substrates / Rigid-flexible substrates" are alternatives to conventional wiring connections using wires or ribbon cables. Flexible printed circuits can reduce space and weight while improving reliability. They are made by etching copper-clad materials and using a thin polymer resin film as insulation between the conductor circuit patterns. In electronic device enclosures, turnkey subassemblies may be utilized, incorporating aerospace-grade connectors at the ends for space-saving and lightweight assembly. 【Features】 ■ Single-sided and double-sided flexible substrates ■ Multi-layer and rigid-flexible substrates ■ Electrical and optical flexible substrates ■ Specialized for IPC 6012/6013 Class 3, Types 1 to 4 *For more details, please refer to the PDF materials or feel free to contact us.
By applying a reinforcement plate, component mounting is also possible! It is often used as a substitute for FFC.
We would like to introduce the "Single-Sided/Dual-Sided Flexible Printed Circuit Boards" handled by Matsuwa Sangyo Co., Ltd. The single-sided (1 layer) type is a common specification for flexible printed circuit boards and is often used as a substitute for FFC. There are types with and without an adhesive layer between the base material and copper foil, and we can accommodate both at our company. The dual-sided (2 layers) type allows for more flexible wiring by incorporating through-holes (TH) into the flexible printed circuit board. Please feel free to consult us about multilayer flexible printed circuit boards with three layers or more. 【Shortest Delivery Record Examples】 ■ 1 layer ⇒ Shortest 2 days (AM data ⇒ shipped the next day) ■ 2 layers ⇒ Shortest 2 days (8 AM data ⇒ shipped the next day) *For more details, please refer to the related links or feel free to contact us.
We have a wealth of experience in custom and OEM projects.
■Features Flexible printed circuit boards (FPC boards) excel in flexibility and thinness, maintaining their electrical properties even when bent. The materials used for flexible printed circuit boards (FPC boards) include polyimide, known as coverlay, as an insulator, solder resist, and copper as the conductor. The basic structure of flexible printed circuit boards (FPC boards) consists of a film-like insulator with an adhesive layer formed on top, followed by a layer of conductor foil. The insulator covers and protects all areas except for the terminal and soldering sections. Produced in China, they are low-cost and ideal for value-added proposals. ■Specifications Base material thickness, copper foil thickness, copper foil type, coverlay color, resist color, and surface treatment will be manufactured according to customer specifications.
Double-sided type that allows for complex wiring.
This is an FPC with conductor patterns on both sides, allowing for complex wiring.
![[Example of Printed Circuit Board Manufacturing] Rigid-Flexible Board](https://image.mono.ipros.com/public/product/image/7c0/2001120580/IPROS81776454173382698581.png?w=280&h=280)
Effective even in cases where component mounting is limited! Here are examples of rigid-flexible circuit board manufacturing.
We would like to introduce an example of our "Rigid-Flexible Printed Circuit Board" manufacturing. This board integrates rigid and flexible substrates. It is effective for use in compact spaces, such as small modules, or in cases where component placement is limited. Please feel free to contact us when you need assistance. 【Overview】 ■ 6-layer IVH structure (FPC layers L4-5) ■ 4-layer 1-2-1 build-up structure (FPC layers L2-3) *For more details, please refer to the PDF document or feel free to contact us.
It is a flexible substrate effective for high-density wiring. FPC
Unlike conventional through holes, to avoid penetrating the hole, a via is placed directly under the pad. Fine hole processing using lasers is possible, making it effective for ultra-high-density wiring, etc. With the miniaturization and thinning of mobile devices, as well as the enhancement of communication devices, there is an increasing demand for high-density mounting of narrow pitch, multi-pin packages. Consequently, flexible substrates are also advancing in terms of high-layer count and high density. FPC
It is possible to create a simple mock-up of the base for those who want to analyze the internal structure of FPC products, troubleshoot issues, or pre-verify complex product shapes.
We would like to introduce the services provided by Stay Electronics Co., Ltd. The "Flexible Circuit Board Mock Production using a High-Performance Cutting Plotter" is a service that creates simple mock-ups of flexible circuit boards using polyimide film for those who have never handled flexible circuit boards before or wish to pre-validate complex product shapes. Additionally, the "Image Analysis using a Super Depth Multi-Angle Lens Microscope" can be utilized for internal structure analysis and defect analysis of FPC products. *For questions or inquiries, please call us or contact us at the email address below. 042-774-4555 stay-4555@staydenshi.jp Contact Person: Kumada, Kikuchi [Service Operations] ■ Image Analysis using a Super Depth Multi-Angle Lens Microscope ■ Flexible Circuit Board Mock Production using a High-Performance Cutting Plotter *For more details, please refer to the PDF document or feel free to contact us.
A large number of flexible circuit boards that are thin and lightweight, making them excellent for space-saving solutions!
This catalog features a wide range of "Flexible Printed Circuits (FPC)" that our company handles. We offer products such as "High-Flex FPC," which demonstrates excellent bending performance even in narrow spaces, "Self-Supporting Sliding FPC," which can slide and bend while remaining upright in the air, and "Power FPC," which can handle high currents. 【Contents】 ■ FPC Product Concepts ■ Areas of Achievement ■ Process Overview ■ What is a Flexible Printed Circuit (FPC)? ■ Product Introduction *For more details, please refer to the PDF document or feel free to contact us.
It is a flexible substrate that allows for a highly reliable connection.
By partially removing the base film, it is possible to form a conductor. By narrowing the pattern width, reliable connections to the opposing circuit or device can be achieved, similar to wire bonding. It is used in areas that require high density and high reliability, such as probes.
Widely used as alternatives for fine coaxial cables, wire harnesses, and cables for medical devices. The spacing and width of the slits can be specified!
The "slit flexible substrate" is a flexible substrate with excellent bendability that has been processed with slits, allowing for "twisting" and "torquing." It is widely used as an alternative to fine coaxial cables, wire harnesses, and cables for medical devices, and since the spacing and width of the slits can be specified, it offers greater freedom for customers. 【Features】 ■ A bendable cable flexible substrate with 0mm slits processed between patterns ■ Can be used with "twisting" and "torquing" compared to conventional products ■ The spacing and width of the slits can be specified *For more details, please refer to the PDF materials or feel free to contact us.
Flying lead structure
It is an FPC that can make electrical contact from both sides.
High through-hole connectivity
This is an FPC that uses polyimide in all layers with a configuration of three or more layers. It can be manufactured up to 10 layers.
![High Current Flexible Circuit Board [*FPC Technology Catalog Available]](https://image.mono.ipros.com/public/product/image/c7d/2000477292/IPROS51770483967615096271.png?w=280&h=280)
Slim shape compatible with high current. Can be curved, suitable for integration into narrow spaces. An alternative to busbars and harnesses.
Our "High Current Flexible Wiring Board" is a product designed for high current wiring, intended as a substitute for busbars and harnesses. By forming a copper foil layer with a conductor thickness of 75 to 90 μm, it is possible to carry higher currents than standard flexible printed wiring boards. The substrate uses polyimide film, and soft resist ink is used as the insulating material, allowing for flexibility, which makes it suitable for installation in tight spaces. 【Features】 ■ Capable of carrying high currents ■ Can be installed and bent in narrow spaces ■ Compatible with through-hole components and surface-mounted components ■ Can integrate connections between substrates, contributing to a reduction in assembly labor *For more details, please refer to the PDF document. Feel free to contact us with any inquiries.
We propose an extremely thin and highly flexible FPC.
It excels in various characteristics such as thinness, lightness, flexibility, resistance to bending, and resistance to breaking. Due to its excellent properties, it is used in movable parts such as sliding and twisting.
![[Case Study] Flexible Circuit Board Product Delivery Record](https://image.mono.ipros.com/public/product/image/a82/2000321565/IPROS5294864867105400836.jpg?w=280&h=280)
Introducing a case study on the implementation of flexible substrates by Murakami Electronics Co., Ltd.!
Murakami Electronics Co., Ltd. is a manufacturer of both double-sided and multilayer printed circuit boards, specializing in prototyping and mass production. We will introduce examples of flexible circuit board applications, including "4-layer flex," "4-layer rigid flex," and "aluminum substrates." 【Case Studies】 ■ Double-sided electrolytic gold plating coverlay reinforcement board (PI) ■ 4-layer flex coverlay flux ■ 4-layer rigid flex flux ■ Aluminum substrate *For more details, please refer to the PDF document or feel free to contact us.
The Big Elec flexible circuit board compatible with high current has three features.
Big Elec is a flexible circuit board designed for high current wiring, achieving a flat shape and thin profile as an alternative to busbars and wire harnesses. It boasts three remarkable features. 【Feature 1】 Low Inductance Thanks to its unique structure, it achieves lower inductance compared to conventional wires with the same conductor cross-section. When switching high currents at high frequencies, high inductance can cause significant voltage spikes, potentially damaging high-current electronic components. Big Elec's low inductance reduces voltage spikes, contributing to the reliability of high-current electronic components. 【Feature 2】 Flat Shape and Flexibility Its unique structure allows for a thin conductor, flat shape, and flexibility. It is flatter than traditional wire harnesses and can handle higher currents than conventional flexible circuit boards. 【Feature 3】 High Design Freedom It ensures the same design freedom and usability as printed circuit boards. Pattern wiring and external shapes can be customized to meet specific requirements. It also supports the mounting of electronic components and connectors using paste solder.
Passed long-term heat resistance test at 200℃ for 1000 hours! High-temperature durable flexible substrate with insulation characteristics exceeding JIS standards.
The "Long-term High-Temperature Durable Flexible Circuit Board" is an FPC that achieves long-term heat resistance without the use of epoxy-based adhesives, making it suitable for harsh conditions in high-temperature environments. Even after undergoing our unique long-term high-temperature test conditions of 200°C for 1000 hours, the insulation resistance, continuity resistance change rate, and dielectric strength meet the JIS passing standards. 【Main Features】 1. Achieves high-temperature durability with a structure that does not use epoxy-based adhesives. 2. Heat resistance suitable for long-term use in high-temperature environments. 3. Insulation properties are maintained even after the long-term high-temperature test of 200°C for 1000 hours. For more details, please refer to the PDF document or feel free to contact us.
It is a flexible substrate that combines heat resistance and transparency. FPC
Compared to glass materials, it is possible to create unique design concepts not only for flat surfaces but also for curved surfaces, folding, and wrapping, thereby expanding the design possibilities for mounted devices. It is expected to be used as a substitute for glass substrates in applications such as: - Transparent conductive substrates for touch panels - Organic EL and LED lighting substrates - Displays for mobile phones. Additionally, bare chip LEDs will be implemented on transparent polyimide substrates using wire bonding, followed by resin encapsulation. Light will pass through the transparent polyimide and beautifully illuminate the opposite side.
Supports low transmission loss and impedance matching! There are various applications such as mobile electronic devices and IoT devices.
The "High-Frequency Compatible FPC (MPI Specification)" is a product designed to support low transmission loss and impedance matching. 〇 It has excellent heat resistance and can accommodate solder mounting and bonding. 〇 It allows for high flexibility in processing, similar to standard polyimide. ● FPC high-frequency analysis service (optional) It can be used for various applications. 【Examples of Applications】 ■ Mobile electronic devices such as smartphones ■ Optical communication modules ■ IoT devices ■ Video equipment (4K/8K) ■ Other alternatives to coaxial cables #Flex #FPC #FlexibleCircuitBoard #FlexiblePrintedCircuitBoard #CircuitBoard #PrintedCircuitBoard #HighFrequency #Impedance #ShortLeadTime #MassProduction
Introducing a flexible printed circuit board (FPC) that balances transparency and solderability!
"Transparent FPC" is a flexible printed circuit board (FPC) that excels in transparency and heat resistance, using transparent polyimide film as its substrate. We have worked on developing an FPC that achieves both high heat resistance and transparency by adopting a highly heat-resistant transparent polyimide film, thereby solving the issues of warping and dimensional changes caused by heat during reflow. As a result, it can be applied to various fields such as wearable devices and medical equipment, which prioritize design. [Features] - Uses highly heat-resistant transparent polyimide film - Can utilize the existing design rules of conventional FPCs - Proposes new wiring styles in fields such as medical, lighting, and industrial equipment *For more details, please refer to the PDF document or feel free to contact us.
Combining PTFE base and low dielectric coverlay to produce various low-loss FPCs!
Our company manufactures low-loss flexible substrates (GHz band, Microstrip Line). We would like to introduce a flexible substrate that significantly improves transmission loss compared to the combination of polyimide-based and standard coverlay products. Using a PTFE base with a low-dielectric coverlay, we can expect a 60-70% improvement in transmission loss at the 40GHz band compared to standard products. Additionally, while the performance is slightly lower compared to PTFE-based substrates, a combination of LCP base and LCP coverlay can also expect about a 50% improvement in transmission loss and is suitable for long-term heat resistance and low outgassing applications due to the absence of adhesives. *For more details, please refer to the PDF materials or feel free to contact us. *Abbreviation explanations: PTFE ... Fluoropolymer LCP ... Liquid Crystal Polymer
Flexible circuit board
Flexible substrate compatible with the "JTEG Phase6" test chip for LCD driver evaluation □ Product names JKIT COF TEG_50-A / JKIT COF TEG_50-B JKIT COF TEG_50-C / JKIT COF TEG_40-A JKIT COF TEG_40-B / JKIT COF TEG_40-C JKIT COF TEG_35-A / JKIT COF TEG_35-B JKIT COF TEG_30-A / JKIT COF TEG_30-B JKIT COF TEG_25-A
